SMT & THT PCB Assembly Services for OEM Electronics

Surface Mount • Through-Hole • Mixed-Technology PCB Assembly

Leader Global Electronics provides SMT and through-hole PCB assembly services from our Taiwan manufacturing facility for U.S. and international OEM customers.

We support prototype, NPI, pilot, and repeat production with component sourcing, PCB fabrication, SMT/THT assembly, inspection, programming, functional testing, and box build integration.

Before quotation and production, our engineering team reviews BOM, Gerber, Pick & Place data, assembly drawings, programming requirements, and test requirements for manufacturability and production readiness.

PCB Assembly at a Glance

Taiwan-Based PCB Assembly
SMT, THT & Mixed-Technology Assembly
Components Down to 01005
BGA, QFN, LGA & Fine-Pitch Assembly
Single-Sided & Double-Sided SMT
Manual, Wave & Selective Soldering
SPI, AOI & X-Ray Inspection
IC / MCU Programming
ICT & Functional Testing
Prototype, NPI, Pilot & Repeat Production
Turnkey, Partial-Turnkey & Consigned Manufacturing
Box Build & System Integration
Maximum PCB Size: 500 × 500 mm
ISO 9001, ISO 13485 & ISO 14001 Certified
NDA Available Upon Request

Request a PCB Assembly Quote

For quotation, please send your complete manufacturing files and project requirements.

Recommended RFQ Package

BOM with manufacturer names and manufacturer part numbers (MPNs)
Gerber files
PCB fabrication specifications and stack-up, if available
Pick & Place data
Assembly drawings
Required quantities
Expected annual volume, if available
Programming required: Yes / No
Functional testing required: Yes / No
Test procedure, if available
Estimated test time per board if testing is required
Special assembly requirements
Target production schedule

For existing products or manufacturing transfer projects, available work instructions, approved component information, test procedures, revision history, and known production issues can also be provided.

Our engineering and manufacturing teams review the submitted information before quotation and production planning.

Email: sales@leaderelec.com.tw

NDA available upon request.

SMT PCB Assembly

Our SMT production lines support prototype, NPI, pilot, and repeat production for OEM electronics.

SMT assembly capabilities include:

01005 Passive Components
Fine-Pitch ICs
BGA
QFN
LGA
CSP
Bottom-Terminated Components
Single-Sided SMT Assembly
Double-Sided SMT Assembly
Lead-Free / RoHS Manufacturing
Automated Solder Paste Printing
High-Speed Pick-and-Place
Controlled Reflow Soldering
SPI & AOI Process Inspection
X-Ray Inspection Where Required

Assembly and inspection requirements are defined according to the PCB design, component packages, customer requirements, and production stage.

THT / Through-Hole PCB Assembly

Through-hole assembly is available for connectors, transformers, relays, switches, power components, and other components requiring THT assembly.

Our THT capabilities include:

Manual Component Insertion
Manual Soldering
Wave Soldering
Selective Soldering
Press-Fit Components
Connector Assembly
Terminal Assembly
Inspection & Functional Testing

THT assembly can be provided as a standalone process or combined with SMT assembly for mixed-technology products.

Mixed-Technology PCB Assembly

Many industrial and OEM products combine fine-pitch SMT devices with through-hole connectors, transformers, relays, power components, or other mechanically demanding components.

We support mixed-technology assemblies incorporating:

Fine-Pitch SMT Components
BGA / QFN / LGA Packages
Through-Hole Connectors
Transformers & Relays
Power Components
Press-Fit Components
Mechanical & High-Current Components

The manufacturing process is planned according to the PCB design, component packages, soldering requirements, inspection requirements, and production quantity.

Engineering Review Before PCB Assembly

Manufacturing issues are generally easier to resolve before materials are purchased and production is scheduled.

Before quotation or production, our engineering team can review available project information including:

Gerber Files
BOM & Manufacturer Part Numbers
Pick & Place Data
Assembly Drawings
PCB Fabrication Requirements
Component Packages & Footprints
Component Polarity & Orientation
SMT / THT Manufacturability
PCB Panelization
Component Availability
Obsolete / EOL / NRND Components
Programming Requirements
ICT / Functional Test Requirements
Test Point Accessibility
Special Assembly Requirements

For power electronics and high-current PCB assemblies, additional manufacturing considerations may include customer-defined PCB copper requirements, component spacing, thermal requirements, connectors, and assembly process requirements.

Issues identified during review can be discussed before procurement or production.

For projects requiring a more detailed manufacturability review, see our PCB Assembly DFM Review service.

Component Sourcing & Material Models

PCB assembly projects can be supported using different material sourcing models according to customer requirements.

Turnkey PCB Assembly

We coordinate PCB fabrication, component procurement, PCB assembly, inspection, programming, testing, and other agreed manufacturing requirements.

Partial-Turnkey PCB Assembly

Customers may provide selected critical or allocated components while we source the remaining BOM and manage the agreed manufacturing processes.

Consigned PCB Assembly

Customers provide some or all PCB and component materials while we perform the agreed assembly, inspection, programming, testing, or integration processes.

Component substitutions are not made without customer review and approval.

For projects requiring complete material procurement and coordinated manufacturing, see our Turnkey PCB Assembly services.

Inspection & Quality Control

Inspection requirements are defined according to the PCB design, component packages, customer specifications, and manufacturing requirements.

Depending on the project, inspection may include:

Incoming Material Verification
First Article Inspection (FAI)
Solder Paste Inspection (SPI)
Automated Optical Inspection (AOI)
X-Ray Inspection
In-Process Inspection
Final Quality Verification
ESD / MSD Control
Material Traceability
BOM & PCB Revision Control

X-Ray inspection is available for BGA and other packages with hidden solder joints where required.

Customer-specific inspection and acceptance requirements can be incorporated into the manufacturing plan.

Programming & Functional Testing

Programming and production testing can be incorporated according to project requirements.

Available support may include:

IC / MCU Programming
Firmware Loading
Power-On Verification
In-Circuit Testing (ICT)
Functional Testing (FCT)
Customer-Defined Test Procedures
Existing Test Fixture Integration
Custom Test Fixture Development

For customer-specific functional testing, our engineering team can review test points, operating conditions, measurements, communication interfaces, programming requirements, test procedures, and pass / fail criteria.

If the customer already has an established test fixture or fixture design, the available documentation can be reviewed for implementation in our manufacturing process.

Where required, custom production test fixtures can be developed according to the agreed test requirements.

PCB Assembly Manufacturing Capabilities

Our Taiwan manufacturing facility supports:

5 SMT Production Lines
1 THT Assembly Line
28,500 sq.ft Manufacturing Facility
Up to 6.2 Million Component Placements per Day
Components Down to 01005
BGA, QFN, LGA & CSP Assembly
Fine-Pitch PCB Assembly
Single-Sided & Double-Sided SMT
SMT, THT & Mixed-Technology Assembly
Maximum PCB Size: 500 × 500 mm
SPI, AOI & X-Ray Inspection
ICT & Functional Testing
Box Build & System Integration
RoHS Manufacturing Support
ESD / MSD Control

→ View PCB Assembly Manufacturing Capabilities

→ View SMT & PCB Assembly Equipment

Prototype, NPI & Repeat Production

Our PCB assembly services support OEM projects from prototype and NPI through pilot and repeat production.

For early builds, manufacturing feedback related to component sourcing, PCB assembly, programming, inspection, testing, and manufacturing documentation can be reviewed before the product moves into repeat production.

For established products, material planning and production scheduling are reviewed according to order quantity, forecast requirements, component lead times, testing requirements, and delivery schedules.

Learn more → Prototype PCB Assembly

Learn more → NPI & Pilot Production

Box Build & System Integration

For projects requiring manufacturing beyond PCB assembly, box build and system integration can be incorporated according to product requirements.

Available services may include:

PCB Assembly Installation
Cable & Wire Harness Integration
Connector Assembly
Enclosure Integration
Mechanical Assembly
Firmware Programming
Functional Testing
Final Inspection
Packaging

This allows PCB assembly, wiring, mechanical integration, programming, and final testing to be coordinated within the agreed manufacturing scope.

Learn more → Box Build Assembly

Typical PCB Assembly Workflow

Engineering Review → PCB Fabrication & Material Preparation → SMT Assembly → THT Assembly Where Required → Inspection → Programming & Testing → Final Quality Verification → Box Build Where Required → Delivery

The exact manufacturing flow is defined according to the PCB design, component packages, sourcing model, inspection requirements, testing requirements, and production stage.

PCB Assembly FAQ

What files are required for a PCB assembly quotation?

Typical quotation files include a BOM with manufacturer part numbers, Gerber files, Pick & Place data, assembly drawings, required quantities, and applicable programming or functional test requirements.

PCB fabrication specifications, stack-up, test procedures, and special assembly requirements should also be provided where applicable.

Do you support both SMT and through-hole assembly?

Yes. We support SMT, through-hole, and mixed-technology PCB assemblies according to the PCB design and component requirements.

Can you assemble BGA, QFN, LGA, and fine-pitch components?

Yes. Our SMT capabilities include BGA, QFN, LGA, CSP, fine-pitch packages, and passive components down to 01005.

X-Ray inspection is available for components with hidden solder joints where required.

Do you provide programming and functional testing?

Yes. Depending on project requirements, production support can include IC / MCU programming, firmware loading, ICT, functional testing, customer-defined test procedures, and test fixture integration.

Request a PCB Assembly Quote

For SMT, THT, or mixed-technology PCB assembly projects, please send your complete manufacturing files and project requirements.

Email: sales@leaderelec.com.tw

NDA available upon request.

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