Embedded Files
We offer comprehensive electronics manufacturing capabilities, including PCB assembly, SMT & DIP production, inspection, and testing services, covering the entire production process from PCB fabrication and assembly to final product delivery.
All manufacturing is performed in-house under strict quality control systems to ensure high efficiency, precision, and consistent product quality.
1. PCB Assembly
（SMT / THT）
• High-speed SMT placement supporting 01005 components, BGA, QFN, and LGA packages
• THT / DIP insertion and manual soldering
• Single-sided, double-sided, and mixed-technology PCB assembly
• Support for multi-layer, rigid, and rigid-flex PCBs
2. Testing & Inspection
• 100% AOI (Automated Optical Inspection)
• X-ray inspection for BGA and hidden solder joints
• ICT (In-Circuit Testing)
• Functional testing based on customer specifications
3. Process Capabilities
• Maximum PCB size: up to 500 × 500 mm
• Board thickness range: 0.4 mm – 4.0 mm
• Minimum pad pitch: 0.25 mm
• Lead-free and RoHS-compliant manufacturing processes
4. Production Modes
• No strict MOQ for prototyping and low-volume production
• Flexible production support for prototype builds, small-batch, and medium-volume manufacturing
The specifications listed above represent general manufacturing capability ranges.
Please contact us to confirm feasibility and requirements for special or customized specifications.
Page updated
Google Sites
Report abuse