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We offer a full range of electronics manufacturing capabilities, from PCB fabrication to final product delivery, with complete in-house production and quality control to ensure high efficiency, precision, and consistency.
1. PCB Assembly
（SMT / THT）
High-speed SMT placement (down to 01005, BGA, QFN, LGA), THT/DIP insertion & manual soldering.
Single-/double-sided and mixed assembly for rigid, flex (FPC), and rigid-flex PCBs.
2. Testing & Inspection
100% AOI (Automated Optical Inspection)
X-ray for BGA solder-joint analysis.
ICT (In-Circuit Testing)
FCT (Functional Testing)
Burn-in upon request with traceable QA reports.
3. Process Capabilities
PCB size:
max 500 × 500 mm
Board thickness:
0.4 mm ~ 4.0 mm
Min pad pitch:
0.25 mm
Min hole size:
0.2 mm
SMT Daily Throughput (Resistors/Capacitors):
1.2M–1.5M placements
4. Production Modes
No MOQ (no minimum order quantity) — we accept any amount.
Flexible builds for low-volume prototyping, medium-volume pilot runs, and high-volume mass production with reliable lead time.
The above values are general capacity ranges.
Please contact us for confirmation of special specifications.
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