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Leader Global Electronics provides ISO-certified PCB assembly and turnkey EMS manufacturing services from our Taiwan-based facility, supporting OEM customers from prototype and NPI builds through scalable production.
Our manufacturing team supports component sourcing, PCB assembly, testing, box build integration, and production planning to help OEM customers move efficiently from prototype and NPI builds into production.
Why OEM Customers Choose Our Taiwan Manufacturing Facility
✓ Taiwan-Based PCB Assembly & EMS Manufacturing
✓ ISO 9001, ISO 13485 & ISO 14001 Certified Management Systems
✓ Prototype, NPI & Production Manufacturing Support
✓ Turnkey, Partial Turnkey & Consigned Manufacturing Models
✓ Dedicated Engineering & Manufacturing Team
✓ Global OEM Customer Support
Many PCB assembly issues are identified before production begins, including component availability constraints, manufacturability concerns, sourcing risks, and documentation gaps.
To help reduce these risks, our engineering team reviews project files before quotation and production planning to support manufacturing readiness and project execution.
✓ Engineering-Led DFM Review
✓ BOM Availability & Sourcing Assessment
✓ Production Readiness Evaluation
✓ Manufacturing Feasibility Review
Ready to Discuss Your PCB Assembly Project?
👉 Send your BOM, Gerber files, assembly drawings, or project requirements for engineering review and quotation support.
Engineering review and quotation lead time may vary depending on project complexity, BOM completeness, component sourcing requirements, and manufacturing considerations.
Early-stage projects, prototype builds, NPI programs, and partial documentation are welcome.
If you are evaluating Taiwan PCB assembly partners, our team can review manufacturability, assess component availability, and provide project-specific feedback together with a quotation.
1. PCB Assembly（SMT / THT）
1. PCB Assembly（SMT / THT）
High-speed SMT placement supporting 01005 components, BGA, QFN, and LGA packages
Mixed-technology assembly (SMT + THT / DIP)
Single-sided, double-sided, and multi-layer PCB assembly
Support for rigid, rigid-flex, and HDI boards
Lead-free and RoHS-compliant processes
Engineering review and DFM analysis support manufacturability evaluation and production readiness before manufacturing begins.
4. Process Capabilities
4. Process Capabilities
Maximum PCB size: up to 500 mm × 500 mm
Board thickness range: 0.4 mm – 4.0 mm
Minimum pad pitch: 0.25 mm
Support for BGA, QFN, LGA and Fine-Pitch Components
Fine-pitch and high-density assembly capability
Controlled ESD Manufacturing Environment
Process controls comply with IPC-A-610 workmanship standards (where specified) and are supported by ISO-certified quality management systems.
2. Manufacturing Capacity
2. Manufacturing Capacity
Our manufacturing facility is designed to support both prototype builds and scalable production programs, providing flexibility across different stages of product development and manufacturing.
5 SMT Production Lines
1 THT Assembly Line
Up to 6.2 Million Component Placements Per Day (R/C Equivalent)
Maximum PCB Assembly Size: 500 mm × 500 mm
Prototype, NPI & Production Support
Turnkey, Partial Turnkey & Consigned Manufacturing
Our manufacturing facility is structured to support prototype, NPI, pilot-run, and production manufacturing programs with scalable capacity and production flexibility.
5. Production Modes
5. Production Modes
No strict MOQ for prototype and low-volume production
Flexible batch sizes from pilot builds to scalable programs
Turnkey, Partial Turnkey & Consigned Manufacturing Support
Support for Prototype Builds, Engineering Validation Runs, and Production Ramp-Up
Production Capability Range:
We support prototype validation, NPI programs, pilot runs, and low-to-mid volume manufacturing.
Our manufacturing approach emphasizes engineering support, production flexibility, and controlled manufacturing processes throughout the product lifecycle.
3. Testing & Inspection
3. Testing & Inspection
100% AOI (Automated Optical Inspection)
X-ray Inspection for BGA and Hidden Solder Joints
ICT (In-Circuit Testing)
Functional Testing (FCT) Based on Customer Specifications
Incoming Quality Control (IQC) and Outgoing Quality Control (OQC)
First Article Inspection (FAI) Available Upon Request
SPI (Solder Paste Inspection) for Process Verification
Reflow profiles are monitored and validated to support solder joint quality and process consistency.
Inspection reports and test records can be provided based on project requirements.
6. From Prototype to Scalable Production
6. From Prototype to Scalable Production
Whether you are developing a new product or transitioning from prototype to volume production, we provide:
Engineering review and DFM feedback
BOM availability and sourcing assessment
Pilot-run and NPI support
Production ramp-up support
Quality inspection reports (AOI, X-Ray, ICT & FCT)
Box build and system integration support
Global logistics coordination
Engineering review and quotation lead time may vary depending on project complexity, BOM completeness, component sourcing requirements, and manufacturing considerations.
Ready to Start Your PCB Assembly Project in Taiwan?
Looking for a reliable Taiwan PCB assembly manufacturer for your OEM, prototype, NPI, or production project?
Leader Global Electronics supports OEM customers with engineering review, component sourcing, PCB assembly, testing, and manufacturing support from prototype through production.
✓ DFM review before production
✓ BOM availability and sourcing assessment
✓ Manufacturing feasibility evaluation
✓ ISO 9001, ISO 13485 & ISO 14001 certified management systems
✓ Prototype, NPI & Production manufacturing support
👉 Send your BOM, Gerber files, assembly drawings, or project requirements for engineering review and quotation support.
Our engineering team can review manufacturability, evaluate component availability, and provide project-specific feedback together with a quotation.
Engineering review and quotation lead time may vary depending on project complexity, BOM completeness, component sourcing requirements, and manufacturing considerations.
NDA available upon request.
Early-stage projects, prototype builds, NPI programs, and partial documentation are welcome.
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