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Leader Global Electronics operates a Taiwan-based PCB assembly and EMS manufacturing facility with SMT production lines, THT assembly, solder paste printing, lead-free reflow, inspection, and testing equipment.
Our SMT and inspection equipment supports prototype, NPI, pilot, and repeat PCB assembly, including BGA, QFN, LGA, fine-pitch components, and mixed SMT/THT production.
SPI, AOI, X-Ray, ICT, and functional testing are available based on project and inspection requirements.
Learn more about our Taiwan PCB Assembly manufacturing services.
1. SMT & THT Production Equipment
Our production equipment supports prototype, NPI, pilot, and repeat PCB assembly.
SMT Production Equipment & Processes
High-speed SMT pick-and-place equipment supporting components down to 01005
Automated solder paste printing
Lead-free reflow with controlled thermal profiling
BGA, QFN, LGA, and fine-pitch component assembly
Single-sided and double-sided SMT assembly
Mixed SMT/THT assembly
THT / DIP Assembly Equipment & Processes
Dedicated THT assembly line
Through-hole component insertion
Manual soldering
Mixed SMT and THT assembly
Connectors, transformers, switches, and other through-hole components
2. Inspection & Testing Systems
Inspection and testing are integrated into our manufacturing process to identify assembly defects, verify solder joint quality, and support product-level functional validation.
SPI — Solder Paste Inspection
SPI is used for solder paste process verification and helps identify printing-related issues before component placement and reflow.
AOI — Automated Optical Inspection
AOI inspection is available according to project and inspection requirements to detect component placement issues, polarity errors, soldering defects, and other visible assembly conditions.
X-Ray Inspection
X-ray inspection supports verification of hidden solder joints and components such as:
▪ BGA
▪ QFN
▪ LGA
▪ Other bottom-terminated components
X-ray inspection can also support solder joint and void evaluation where required by the project.
ICT — In-Circuit Testing
ICT can be implemented based on customer requirements to verify electrical characteristics, component connections, and assembly integrity.
FCT — Functional Testing
Functional testing can be performed according to customer-defined specifications, test procedures, fixtures, firmware, and acceptance criteria.
Burn-In Testing
Optional burn-in testing can be implemented for projects requiring extended operation or controlled stress testing before shipment.
Inspection reports and test records can be provided according to project requirements.
SMT production, inspection, and testing equipment supporting prototype, NPI, pilot, and repeat production.
3. Facility Size & Production Capacity
✓ Factory Area: 28,500 sq. ft.
✓ 5 High-Speed SMT Production Lines
✓ 1 THT Assembly Line
✓ Up to 6.2 Million Component Placements Per Day (R/C Equivalent)
✓ Maximum PCB Assembly Size: 500 mm × 500 mm
✓ Prototype, NPI & Production Support
✓ Turnkey, Partial Turnkey & Consigned Manufacturing
✓ SPI, AOI, X-Ray, ICT & Functional Testing
✓ ISO 9001, ISO 13485 & ISO 14001 Certified Management Systems
For PCB assemblies exceeding our standard manufacturing dimensions or requiring special processes, please provide the PCB data and project requirements for engineering feasibility review.
4. PCB Assembly Processes Supported by Our Equipment
Our equipment and production processes support:
SMT Assembly
THT / DIP Assembly
Mixed SMT/THT Assembly
BGA, QFN & LGA Assembly
Fine-Pitch & High-Density PCB Assembly
Single-Sided & Double-Sided Assembly
Prototype & NPI Builds
Pilot & Repeat Production
PCB Inspection & Functional Testing
5. Quality & Process Control
Equipment capability is supported by controlled manufacturing processes, inspection, traceability, and production records.
Our manufacturing controls include:
ESD-controlled production environment
Standardized work instructions
Material and production traceability
Soldering process control
Reflow profile monitoring
Incoming Quality Control (IQC)
In-process inspection
Outgoing Quality Control (OQC)
Production and test records where required
Manufacturing operations are managed under ISO 9001, ISO 13485, and ISO 14001 certified management systems.
Discuss Your PCB Assembly Requirements
For an accurate engineering review and quotation, please provide a complete RFQ package and production requirements.
RFQ Package Required for Quotation
BOM with manufacturer names and manufacturer part numbers (MPNs)
Gerber files and PCB specifications
Pick & Place / Centroid data
Assembly drawings
Required quantities
Programming required: Yes / No
Functional testing required: Yes / No
Test procedure and acceptance criteria, where applicable
Estimated test time per board, if testing is required
Special manufacturing or inspection requirements
Complete project information is required before quotation so that PCB size, component technology, SMT/THT requirements, inspection, programming, testing, and special manufacturing requirements can be reviewed accurately.
RFQ Email: sales@leaderelec.com.tw
NDA available upon request.
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